State of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Awareness Day

This event is free to attend. Registration is required.

The State of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program was created by OUSD/R&E to develop a sustainable business and operational model for addressing government needs in the Microelectronics (ME) packaging. SHIP will leverage the expertise of commercial industry to develop and demonstrate a novel model to ensure sustained DoD access to secure advanced packaging and test. The model will allow the Department of Defense (DoD) and the Defense Industrial Base (DIB) sustained access to a catalog of proven IP and chiplets to be used to design and build customized multi-chip modules using COTS SOTA devices.

SHIP Awareness Day will bring together the DIB to provide an overview of SHIP, lay out both short-term and long-term goals, and emphasize the important role that the DIB will play in the overall success of the SHIP program. Multi-Chip Package (MCP) topologies will be discussed by the SHIP Digital and SHIP RF performers detailing future technology implementations. These MCPs serve as proof-of-concept demonstrators for the SHIP model, which will ultimately produce a rich ecosystem of MCPs that the DIB can use to modernize military systems with customized SOTA devices.

DIB partners should leave with a clear understanding of what SHIP is, what SHIP is not, and how they can engage and support the development of the SHIP device ecosystem. The DIB partners are vital to the success and sustainment of the SHIP model.

Please note: All attendees must complete a non-disclosure form from both Qorvo and Intel before being allowed to attend.

This event is open to U.S. Citizens only.