Advanced Packaging Overview – Design through Assembly and Test FlipChip and SiP Packages
Advanced Packaging Overview – Design through Assembly and Test: FlipChip and SiP Packages
The webinar will discuss:
- Design implications and considerations
- Substrate discussion
- Different approaches on FlipChip and SiP
- Assembly considerations
- Testing and Qualification
Have questions? Let us know TechnicalHotline@integra-tech.com
Relevant Government Agencies
Air Force, Army, DOD & Military, Dept of Agriculture, Dept of Homeland Security, NASA, Coast Guard, National Guard Association
Event Type
Webcast
This event has no exhibitor/sponsor opportunities
When
Thu, Oct 22, 2020, 1:00am - 2:00am
PT
Website
Click here to visit event website
Organizer
Integra Technologies
