Designing the Future: Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems

Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges. The panelists will also share their insights on overcoming compatibility and regulatory compliance hurdles. Whether you are an engineer, manager or a policymaker looking to deepen your 3DHI knowledge, this panel offers insightful discussions to help anticipate and address future microelectronics design challenges for aerospace, government, and defense systems.